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Dell PowerEdge R570 210-BPCH | Single Intel Xeon 2U Rack Server

Dell PowerEdge R570 210-BPCH Scale-Out 2U Server
Dell PowerEdge R570 210-BPCH Scale-Out 2U Server
Dell PowerEdge R570 210-BPCH Scale-Out 2U Server
Dell PowerEdge R570 210-BPCH Scale-Out 2U Server
Dell PowerEdge R570 210-BPCH Scale-Out 2U Server
long delivery time

Advantages:

  • Virtualization
  • Scale-Out Database
  • Medium VM Density or VDI
  • Software-Defined Storage Node
€99,999.99 *

Prices plus VAT plus shipping costs

Do you need help?
Your contact person:
Gunnar Dietrich
Sales
Gunnar Dietrich
  • Dell
  • 1254942

  • 210-BPCH

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Dell PowerEdge R570 (210-BPCH): Streamlined Performance and Scalable One-Socket Xeon 6 CPU... more

210-BPCH Product Information

Dell PowerEdge R570 (210-BPCH): Streamlined Performance and Scalable One-Socket Xeon 6 CPU for Balanced Data Centre Performance in 2U

 

CPU:     

Single Socket LGA 7529, Intel Xeon 6 Series Processors

Up to 144 E-Cores / 86 P-Cores per Processor with R1S option, supports up to 350W cTDP

 

GPU Accelerators:

Up to 3x 400W DW, Up to 4x 75W SW

 

RAM:

16x DIMM slots, up to 4TB RAM DDR5-6400MT/s RDIMM ECC

 

LAN:

1x 1GbE Dedicated BMC Ethernet Port

2x OCP NIC 3.0 cards (optional)

 

Expansion Slots:

2x PCIe Gen5 x16 Full-Height, Full-Length slots

4x PCIe Gen5 x16 Full-Height, Half-Length slots

 

M.2:

2x M.2 NVMe SSDs or M.2 Interposer board (DC-MHS): 2x M.2 NVMe SSDs or USB

 

Storage:

— Front bays

Up to 32 x EDSFF E3.S (hot-aisle) Gen5 NVMe max 491.52 TB*

— Rear bays

Up to 4 x EDSFF E3.S Gen5 NVMe max 61.44 TB

SKU Overview
R570 (210-BPCH) Single Intel Xeon 6 with E/P-Cores CPU, 32x + 4x E3.S NVMe Hot-Swap SSD drive bays, 6x PCIe Gen5 (2x FHFL, 4x FHHL), 2x 1500W redundant PSUs

Datasheet for Dell PowerEdge R570 (210-BPCH)

Processor
CPU Single Intel® Xeon 6 E- core processor with up to 144 cores per processor or
Single Intel® Xeon 6 P- core processor with up to 86 Cores with R1S option.
Chipset
-
GPU Accelerators
Max GPU Count Up to 3 x 400W DW; Up to 4 x 75W SW
System Memory
Memory 16 DDR5 DIMM slot, supports RDIMM 4TB max, speeds up to 6400 MT/s
Intel® Xeon® 6 E-core processor - supports 1 TB max
Intel® Xeon® 6 P-core processor with up to 86 cores with R1S option - supports 4 TB max
Supports registered ECC DDR5 DIMMs only
Storage Controllers
Internal Controllers (RAID) PERC H365i DC-MHS, PERC H965i DC-MH, PERC H365i Adapter PERC H965i Adapter
External Controllers PERC H965e*, HBA 465e*
Internal Boot Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS), M.2 interposer with up to 2 x M.2 NVMe SSDs*, USB
Storage
Front Bays Up to 12 x 3.5-inch SAS (HDD) RAID max 288 TB
Up to 12 x 3.5-inch SAS/SATA (HDD) RAID max 288 TB
Up to 8 x 2.5-inch NVMe (SSD) RAID max 122.88 TB
Up to 8 x 2.5-inch NVMe (SSD) max 122.88 TB
Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) max 30.72 TB
Up to 8 x 2.5-inch SAS/SATA/Universal (HDD/SSD) max 122.88 TB
Up to 16 x 2.5-inch SAS/SATA (HDD/SSD) RAID max 61.44 TB
Up to 24 x 2.5-inch SAS4/SATA (HDD/SSD) max 92.16 TB
Up to 8 x EDSFF E3.S (hot-aisle) Gen5 NVMe max 122.88 TB
Up to 8 x EDSFF E3.S (cold-aisle) Gen5 NVMe 122.88 TB
Up to 16 x EDSFF E3.S (cold-aisle) Gen5 NVMe max 245.76 TB
Up to 16 x EDSFF E3.S (hot-aisle) Gen5 NVMe max 245.76 TB
Up to 32 x EDSFF E3.S (hot-aisle) Gen5 NVMe max 491.52 TB
Rear bays Up to 4 x EDSFF E3.S Gen5 NVMe max 61.44 TB
Power Supplies
800 W Platinum/Titanium 100-240 VAC or 240 HVDC, hot swap redundant
1100 W Platinum/Titanium 100-240 VAC or 240 HVDC, hot swap redundant
1500 W Titanium 100-240 VAC or 240 HVDC, hot swap redundant
1500 W 277 Vac and HVDC Titanium, hot swap redundant
1400 W -48 VDC, hot swap redundant*
Cooling Options
Air cooling
Fans
Up to six hot plug fans
Dimensions
Height – 86.8 mm (8.68cm)
Width – 482.0 mm (48.20cm)
Depth – 802.38 mm (80.23cm) with bezel
Depth – 801.49 mm (80.14cm) without bezel
Depth (Cold aisle/Front I/O Configuration) – 814.5 mm (81.45cm) without bezel
Note: Front I/O configuration will not have a bezel.
Form Factor
2U rack server
Embedded Management
iDRAC
iDRAC Direct
iDRAC RESTfull API with redfish
RACADM CLI
iDRAC Service Module (iSM)
Bezel
Optional security bezel
Security
• Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown (requires iDRAC10 Enterprise or Datacenter) • TPM 2.0 FIPS, CC-TCG certified • Chassis Intrusion Detection
OCP Network options
Up to two OCP NIC card 3.0: Two slots on the front or two slots on the rear (optional)
Embedded NIC
1 Gb dedicated BMC Ethernet port
Ports
Front Ports
1 x USB 2.0 Type-C (HOST/BMC Direct)
1 x USB 2.0 Type-A (optional LCP - Secondary KVM)
1 x Mini DisplayPort (optional LCP - Secondary KVM)
1 x DB9 Serial (with front I/O configuration)
1 x Dedicated BMC Ethernet port (with front I/O configuration)

Rear Ports
1 x Dedicated BMC Ethernet port
2 x USB 3.1 Type A ports
1 x VGA

Internal Ports
1 x USB 3.1 Type A port
PCIe
Up to six PCIe slots (x16 connector)
Slot 2: 1 x16 Gen5 Full Height, Half Length or 1 x16 Full Height, Full Length
Slot 3: 1 x16 Gen5 Full Height, Half Length
Slot 4: 1 x16 Gen5 Full Height, Half Length* or 1 x16 Full Height, Full Length* or 1 x16 OCP3.0
Slot 6: 1 x4 Gen4 Boss (optional)
Slot 7: 1 x16 Gen5 Full Height, Half Length or 1 x16 Full Height, Full Length
Slot 9: 1 x16 Gen5 Full Height, Half Length
Slot 10: 1 x16 OCP3.0
Slot 31: 1 x16 Gen5 Full Height, Half Length
Slot 34: 1 x16 OCP3.0 or 1 x4 Gen4 Boss (optional)
Slot 36: 1 x16 Gen5 Full Height, Half Length
Slot 38: 1 x16 OCP3.0

Gen5 PCIe slots: 4
Operating System and Hypervisors
Canonical Ubuntu Server LTS
Microsoft Windows Server with Hyper-V
RedHat Enterprise Linux
SUSE Linux Enterprise Server
VMware ESXi
Order Information
Manufacturer SKU R570 (210-BPCH)
System Building R570 (210-BPCH) can be configured individually