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Gigabyte H263-S63 | 4-Node Dual Xeon 2U High Density Server

Gigabyte H263-S63 4-Node 2U High Density Server
Gigabyte H263-S63 4-Node 2U High Density Server
Gigabyte H263-S63 4-Node 2U High Density Server
Gigabyte H263-S63 4-Node 2U High Density Server
in stock

Advantages:

  • Virtualization
  • Databases
  • Networking
  • HCI
  • Hybrid/Private Cloud Server

special highlight

Liquid cooling solution

€10,679.00 *

Prices plus VAT plus shipping costs

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Christoph Handl
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Christoph Handl
  • Gigabyte
  • 1251897

  • 6NH263S63DR000LAN1

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Gigabyte H263-S63 (6NH263S63DR000LAN1): 2U 4-Node High Density Server - 4th Gen Intel®... more

6NH263S63DR000LAN1 Product Information

Gigabyte H263-S63 (6NH263S63DR000LAN1): 2U 4-Node High Density Server - 4th Gen Intel® Xeon® - Highest performance at minimal noise thanks to liquid cooling

 

— per Node

Mainboard:

Gigabyte MS63-HD1

 

CPU:

Dual Socket LGA-4677, 4th Gen Intel Xeon Scalable Processors 
Intel® Xeon® CPU Max Series
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor

up to 350W CPU TDP

 

RAM:

16x DIMM slots, up to 4TB RAM DDR5-4800MHz

Octa-channel Memory Architecture

 

LAN:

1x Dedicated management port

1x CMC port

 

Expansion Slots:

1x PCI-E 5.0 x16 low-profile slots

1x OCP 3.0 slot w/ PCI-E 5.0 x16

 

M.2:

1x M.2 slot, PCI-E 4.0 x4, Form factor 2280/22110, M-Key (optional)

 

Storage:

2x 2.5" NVMe/SATA/SAS hot-swap drive bays 

 
SKU Overview
H263-S63 Dual Intel Xeon Scalable 4th Gen CPU, 4 Nodes, 2x 2.5" hot-swap drive bays, 1x PCIe (LP), 1x OCP 3.0, 2x 2600W redundant PSUs

Datasheet for Gigabyte H263-S63 (6NH263S63DR000LAN1)

Dimensions (WxHxD, mm) 2U 4 Nodes - Rear access
440 x 87.5 x 840
Motherboard MS63-HD1
CPU 4th Generation Intel® Xeon® Scalable Processors
Intel® Xeon® CPU Max Series
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
Dual processor, CPU TDP up to 350W

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable
Socket Per Node:
2 x LGA 4677

Total:
8 x LGA 4677
Socket E
Chipset Intel® C741 Chipset
Memory Per Node:
16 x DIMM slots

Total:
64 x DIMM slots

DDR5 memory supported only
8-Channel memory architecture
RDIMM modules up to 96GB supported
3DS RDIMM modules up to 256GB supported
Memory speed: Up to 4800 MHz
LAN Per Node:
1 x Dedicated management port

Total:
4 x Dedicated management ports
1 x CMC port
Video Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage Per Node:
2 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

Total:
8 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1

SAS card is required for SAS devices support
SAS Depends on SAS Add-on card
RAID Intel® SATA RAID 0/1
Expansion Slots Per Node:
Riser Card CRSH01U:

- 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0

1 x OCP 3.0 mezzanine slot with PCIe Gen5 x16 bandwidth, from CPU_0
Supports NCSI function

*1 x M.2 slot: (optional)
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports NGFF-2280/22110 cards

Total:
Riser Card CRSH01U x 4:
- 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0

4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0
Support NCSI function

*4 x M.2 slots: (optional)
- M-key
- PCIe Gen4 x4, from CPU_1
- Supports NGFF-2280/22110 cards

*Optional kit for M.2 riser card
PN: 9CMTP061NR-00
Internal I/O Per Node:
1 x TPM header
1 x VROC connector
1 x OCP 3.0 slot
Front I/O Per Node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x System reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x System reset buttons
*1 x CMC status LED
*1 x CMC reset button

*Only one CMC status LED and reset button per system
Rear I/O Per Node:
2 x USB 3.2 Gen1
1 x VGA
1 x RJ45 MLAN
1 x ID button with LED

Total:
8 x USB 3.2 Gen1
4 x VGA
4 x RJ45 MLAN
4 x ID buttons with LED
*1 x CMC port

*Only one CMC port per system
Backplane I/O Speed and bandwidth:
PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s
TPM 1 x TPM header with SPI interface
Optional TPM2.0 kit: CTM010
Power Supply Dual 2600W (240V) 80 PLUS Titanium redundant power supply
Available for 2+1 redundant power supply configuration (optional)

AC Input:
- 100-127V~/ 13.8A, 50-60Hz
- 200-240V~/ 15A, 50-60Hz

DC Input:
- 240Vdc/ 15A

DC Output:
- Max 1000W/ 100-127V~
+ 12.2V/ 81A
+ 12.2Vsb/ 4.5A
- Max 2600W/ 200-220V~
+ 12.2V/ 213A
+ 12Vsb/ 4.5A

Note: The system power supply requires C19 power cord
System Management Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface

Dashboard
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
OS Compatibility Windows Server 2019
Windows Server 2022

Red Hat Enterprise Linux 8.6 (x64) or later
Red Hat Enterprise Linux 8.7 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later
Red Hat Enterprise Linux 9.1 (x64) or later
Red Hat Enterprise Linux 9.2 (x64) or later

SUSE Linux Enterprise Server 15 SP4 (x64) or later

Ubuntu 22.04 LTS (x64) or later
Ubuntu 22.04.1 LTS (x64) or later
Ubuntu 22.04.2 LTS (x64) or later

VMware ESXi 7.0 Update 3i or later
VMware ESXi 8.0 or later
VMware ESXi 8.0 Update 1 or later

Citrix Hypervisor 8.2 LTSR CU1 or later
System Fans 4 x 80x80x38mm (18,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)

Note:
1) The ambient temperature and relative humidity of the environment depend on the inlet supply water temperature and the coolant flow rate.
2) If the relative humidity surpasses 60%, maintain the inlet water temperature between 40°C and 45°C to prevent condensation and ensure optimal system performance.
Packaging Dimensions w/ liquid cooling kit: 1185 x 705 x 409 mm
w/o liquid cooling kit: 1176 x 709 x 322 mm
Packaging Content 1 x H263-S63
1 x Liquid cooling solution kit
24 x Carrier clips
1 x 3-Section Rail kit
Part Numbers - Barebone w/ liquid cooling kit: 6NH263S63DR000LAN1*
- Barebone w/o liquid cooling kit: 6NH263S63DZ000LAN1*
- Motherboard: 9MS63HD1UR-000
- 3-Section Rail kit: 25HB2-A66125-K0R
- CPU liquid cooling kit: 25ST7-100006-C4R
- Front panel board - CFPH004: 9CFPH004NR-00
- Backplane board - CBPH081: 9CBPH081NR-00
- Fan module: 25ST2-88382P-S1R
- Riser card - CRSH01U: 9CRSH01UNR-00
- LAN board - CLBH010: 9CLBH010NR-00
- Power Supply: 25EP0-226000-G1S

Optional parts:
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
- M.2 riser card - CMTP061: 9CMTP061NR-00
- Ring topology kit: 6NH263S62S1000AAN11 (QPA:1)
- Leak sensor board: 6NH263S62S1000LAN11 (QPA:4)
Order Information
Manufacturer SKU H263-S63 (6NH263S63DR000LAN1)
System Building H263-S63 (6NH263S63DR000LAN1) can be configured individually