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Track device being used
Gigabyte H263-S62 | 4-Node Dual Xeon 2U High Density Server
long delivery time
Advantages:
- Virtualization
- Databases
- Networking
- HCI
- Hybrid/Private Cloud Server
- Manufacturer: Gigabyte
-
Order number:
1251893
-
Manufacturer SKU:
6NH263S62DR000AAW1
Configuration not found? Please use our server request form!
Gigabyte H263-S62 (6NH263S62DR000AAW1): High-Density 4-Node-Server für HCI & Hybrid Cloud... more
6NH263S62DR000AAW1 Product Information
Gigabyte H263-S62 (6NH263S62DR000AAW1): High-Density 4-Node-Server für HCI & Hybrid Cloud mit 4th/5th Gen Intel Xeon Scalable CPUs
— per Node
Mainboard:
Gigabyte MS63-HD1
CPU:
Dual Socket LGA-4677, 4th Gen Intel Xeon Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor
up to 225W CPU TDP
RAM:
16x DIMM slots, up to 4TB RAM DDR5-4800MHz
Octa-channel Memory Architecture
LAN:
1x Dedicated management port
1x CMC port
Expansion Slots:
2x PCI-E 5.0 x16 low-profile slots
1x PCI-E 5.0 x16 low-profile slot (optional)
1x OCP 3.0 slot w/ PCI-E 5.0 x16
M.2:
1x M.2 slot, PCI-E 4.0 x4, Form factor 2280/22110, M-Key (optional)
Storage:
6x 2.5" Gen4 NVMe/SATA/SAS hot-swap drive bays
| SKU Overview | ||
|---|---|---|
| H263-S62 | Dual Intel Xeon Scalable 4th Gen CPU, 4 Nodes, 6x 2.5" hot-swap drive bays, 2x PCIe (LP), 1x OCP 3.0, 2x 3000W redundant PSUs | |
Datasheet for Gigabyte H263-S62 (6NH263S62DR000AAW1)
| Dimensions (WxHxD, mm) | 2U 4 Nodes - Rear access 440 x 87.5 x 840 |
|
| Motherboard | MS63-HD1 | |
| CPU | 4th Generation Intel® Xeon® Scalable Processors Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor Dual processor, CPU TDP up to 225W Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable |
|
| Socket | Per Node: 2 x LGA 4677 Total: 8 x LGA 4677 Socket E |
|
| Chipset | Intel® C741 Chipset | |
| Memory | Per Node: 16 x DIMM slots Total: 64 x DIMM slots DDR5 memory supported only 8-Channel memory architecture RDIMM modules up to 96GB supported 3DS RDIMM modules up to 256GB supported Memory speed: Up to 4800 MHz |
|
| LAN | Per Node: 1 x Dedicated management port Total: 4 x Dedicated management ports 1 x CMC port |
|
| Video | Integrated in Aspeed® AST2600 2D Video Graphic Adapter with PCIe bus interface 1920x1200@60Hz 32bpp, DDR4 SDRAM Management chip on CMC board: Integrated in Aspeed® AST2520A2-GP |
|
| Storage | Per Node: 6 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1 Total: 24 x 2.5" Gen4 NVMe/SATA/SAS hot-swappable bays, from CPU_1 SAS card is required for SAS devices support |
|
| SAS | Depends on SAS Add-on card | |
| RAID | Intel® SATA RAID 0/1/10/5 | |
| Expansion Slots | Per Node: Riser Card CRSH01T: - 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0 Riser Card CRSH01U: - 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0 *Riser Card CRSH310 (optional): - 1 x PCIe x16 (Gen5 x16) low-profile slot, from CPU_0 1 x OCP 3.0 slot with PCIe Gen5 x16 bandwidth, from CPU_0 Supports NCSI function **1 x M.2 slot: (optional) - M-key - PCIe Gen4 x4, from CPU_1 - Supports NGFF-2280/22110 cards Total: Riser Card CRSH01T x 4: - 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0 Riser Card CRSH01U x 4: - 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_0 *Riser Card CRSH310 x 4 (optional): - 4 x PCIe x16 (Gen5 x16) low-profile slots, from CPU_1 4 x OCP 3.0 slots with PCIe Gen5 x16 bandwidth, from CPU_0 Support NCSI function **4 x M.2 slots (optional): - M-key - PCIe Gen4 x4, from CPU_1 - Supports NGFF-2280/22110 cards *Optional kit for CRSH310 riser card PN: 9CRSH310NR-00 **Optional kit for M.2 riser card PN: 9CMTP061NR-00 |
|
| Internal I/O | Per Node: 1 x TPM header 1 x VROC connector 1 x OCP 3.0 slot |
|
| Front I/O | Per Node: 1 x Power button with LED 1 x ID button with LED 1 x Status LED 1 x System reset button Total: 4 x Power buttons with LED 4 x ID buttons with LED 4 x Status LEDs 4 x System reset buttons *1 x CMC status LED *1 x CMC reset button *Only one CMC status LED and reset button per system |
|
| Rear I/O | Per Node: 2 x USB 3.2 Gen1 1 x VGA 1 x RJ45 MLAN 1 x ID button with LED Total: 8 x USB 3.2 Gen1 4 x VGA 4 x RJ45 MLAN 4 x ID buttons with LED *1 x CMC port *Only one CMC port per system |
|
| Backplane I/O | Speed and bandwidth: PCIe Gen4 x4 or SATA 6Gb/s or SAS 12Gb/s |
|
| TPM | 1 x TPM header with SPI interface Optional TPM2.0 kit: CTM010 |
|
| Power Supply | Dual 3000W (240V) 80 PLUS Titanium redundant power supply Available for 2+1 redundant power supply configuration (optional) AC Input: - 100-127V~/ 16A, 50-60Hz - 200-240V~/ 16A, 50-60Hz DC Input: - 240Vdc/ 16A DC Output: - Max 1200W/ 100-127V~ + 12.2V/ 98.36A + 12.2Vsb/ 3A - Max 2600W/ 200-207V~ + 12.2V/ 213A + 12.2Vsb/ 3A - Max 3000W/ 208-240V~ + 12.2V/ 245.9A + 12.2Vsb/ 3A Note: The system power supply requires C19 power cord |
|
| System Management | Aspeed® AST2600 management controller GIGABYTE Management Console (AMI MegaRAC SP-X) web interface Dashboard HTML5 KVM Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.) Sensor Reading History Data FRU Information SEL Log in Linear Storage / Circular Storage Policy Hardware Inventory Fan Profile System Firewall Power Consumption Power Control LDAP / AD / RADIUS Support Backup & Restore Configuration Remote BIOS/BMC/CPLD Update Event Log Filter User Management Media Redirection Settings PAM Order Settings SSL Settings SMTP Settings |
|
| OS Compatibility | Windows Server 2019 Windows Server 2022 Red Hat Enterprise Linux 8.6 (x64) or later Red Hat Enterprise Linux 8.7 (x64) or later Red Hat Enterprise Linux 9.0 (x64) or later Red Hat Enterprise Linux 9.1 (x64) or later Red Hat Enterprise Linux 9.2 (x64) or later SUSE Linux Enterprise Server 15 SP4 (x64) or later Ubuntu 22.04 LTS (x64) or later Ubuntu 22.04.1 LTS (x64) or later Ubuntu 22.04.2 LTS (x64) or later VMware ESXi 7.0 Update 3i or later VMware ESXi 8.0 or later VMware ESXi 8.0 Update 1 or later Citrix Hypervisor 8.2 LTSR CU1 or later |
|
| System Fans | 8 x 80x80x38mm (18,300rpm) | |
| Operating Properties | Operating temperature: 10°C to 35°C Operating humidity: 8-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |
|
| Packaging Dimensions | 1180 x 779 x 300 mm | |
| Packaging Content | 1 x H263-S62 8 x CPU heatsinks 24 x Carrier clips 1 x 3-Section Rail kit |
|
| Part Numbers | - Barebone package: 6NH263S62DR000AAW1* - Motherboard: 9MS63HD1UR-000 - 3-Section Rail kit: 25HB2-A66125-K0R - CPU heatsink: 25ST1-453207-C1R/25ST1-453208-C1R - Front panel board - CFPH004: 9CFPH004NR-00 - Backplane board - CBPH7O1: 9CBPH7O1NR-00 - Fan module: 25ST2-88382P-S1R/25ST2-88382Q-S1R - Riser card - CRSH01T: 9CRSH01TNR-00 - Riser card - CRSH01U: 9CRSH01UNR-00 - LAN board - CLBH010: 9CLBH010NR-00 - Power Supply: 25EP0-230009-L0S Optional parts: - C19 power cord 125V/15A (US): 25CP1-018000-Q0R - C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R - M.2 riser card - CMTP061: 9CMTP061NR-00 - Riser card - CRSH310: 9CRSH310NR-00 - Ring topology kit: 6NH263S62S1000AAN11 (QPA:1) |
|
| Order Information | ||
| Manufacturer SKU | H263-S62 (6NH263S62DR000AAW1) | |
| System Building | H263-S62 (6NH263S62DR000AAW1) can be configured individually | |