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Gigabyte H261-NO0 | 4-Node Dual Xeon 2U High Density/HCI Server

Gigabyte H261-NO0 4-node 2U High-Density Server
Gigabyte H261-NO0 4-node 2U High-Density Server
Gigabyte H261-NO0 4-node 2U High-Density Server
Gigabyte H261-NO0 4-node 2U High-Density Server
very few qty in stock

Advantages:

  • HCI
  • Hybrid/Private Cloud Server
€5,539.00 *

Prices plus VAT plus shipping costs

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  • Gigabyte
  • 1248982

  • 6NH261NO0MR-00

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Gigabyte H261-NO0 (6NH261NO0MR-00): High-density 4-node server with 2nd Gen Intel Xeon CPU... more

6NH261NO0MR-00 Product Information

Gigabyte H261-NO0 (6NH261NO0MR-00): High-density 4-node server with 2nd Gen Intel Xeon CPU Systems, 6x Gen3 U.2/SATA/SAS drive bays

 

Mainboard:

Gigabyte MH61-HD6

 

CPU:

Dual Socket LGA-3647, 2nd Gen Intel Xeon Scalable and Intel Xeon Scalable Processors

Intel Xeon Platinum Processor, Intel Xeon Gold Processor, Intel Xeon Silver Processor and Intel Xeon Bronze Processor

Up to 28 Cores / 56 Threads

 

RAM:

12x DIMM slots, up to 2TB RAM DDR4-2933MHz

6-channel memory architecture

 

LAN:

1x dedicated management port

 

Expansion Slots:

2x PCI-E Gen3 low-profile slots 

1x OCP 2.0 Mezzanine slot w/ PCI-E 3.0 x16

 

Storage:

6x 2.5 Gen3 U.2/SATA/SAS hot-swap drive bays

Onboard SATA DOM support

SKU Overview
H261-NO0 Dual Intel Xeon Scalable 2nd Gen CPU, 4 Nodes, 6x 2.5" hot-swap drive bays + Onboard SATA DOM, 2x PCIe (LP), 1x OCP 2.0, 2x 2200W redundant PSUs

Datasheet for Gigabyte H261-NO0 (6NH261NO0MR-00)

Dimensions (WxHxD, mm) 2U 4 Nodes - Rear access
440 x 87 x 840
Motherboard MH61-HD6
CPU 2nd Generation Intel® Xeon® Scalable and Intel® Xeon® Scalable Processors
Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor and Intel® Xeon® Bronze Processor
Dual processor per node
Supports CPU 165W at ambient 35°C
Supports CPU 205W at ambient 30°C

Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable

*This device does not support Intel Omni-Path function
Socket Per Node:
2 x LGA 3647

Total:
8 x LGA 3647

Socket P
Chipset Intel® C621 Chipset
Memory Per Node:
12 x DIMM slots

Total:
48 x DIMM slots

DDR4 memory supported only
6-channel memory architecture
RDIMM modules up to 64GB supported
LRDIMM modules up to 128GB supported
Supports Intel® Optane™ DC Persistent Memory (DCPMM)
1.2V modules: 2933/2666/2400/2133 MHz

Maximum verified DCPMM configuration:
* Ambient temperature 35°C
* 2nd Generation Intel® Xeon® Scalable processor 165W (Max.)
* DCPMM 256GB x2 pcs (Per Node)

DCPMM installation locations:
DIMM_P1_(G1, J1)

Note:
1. 2933MHz for 2nd Generation Intel® Xeon® Scalable Processors only
2. Intel® Optane™ DC Persistent Memory for 2nd Generation Intel® Xeon® Scalable Processors only
3. The maximum number of DCPMM that can be installed is based on a maximum operating (ambient) temperature of 35°C
LAN Per Node:
1 x Dedicated management port

Total:
4 x Dedicated management ports
1 x 10/100/1000 *CMC port

*CMC: Chassis Management Controller, to monitor all status of computing nodes
Video Integrated in Aspeed® AST2500
2D Video Graphic Adapter with PCIe bus interface
1920x1200@60Hz 32bpp, DDR4 SDRAM

Management chip on CMC board:
Integrated in Aspeed® AST2520A2-GP
Storage Per Node:
6 x Gen3 NVMe/SATA/SAS hot-swappable bays
Onboard SATA DOM support (PIN_7, PIN_8 or external cable)

Total:
24 x Gen3 NVMe/SATA/SAS hot-swappable bays

SAS card is required for SAS devices support
RAID For SATA drives:
Intel® SATA RAID 0/1/5/10

For U.2 drives:
Intel® Virtual RAID On CPU (VROC) RAID 0, 1, 10, 5

Note:
1) VROC module is compatible for Intel®SSD only
2) Default 1 PCS VROC module for one 2U 4-Node server system
Expansion Slots Per Node:
Riser Card CRSH010:

- 1 x PCIe x16 (Gen3 x16) low-profile slot, from CPU_0

Riser Card CRSH011:
- 1 x PCIe x8 (Gen3 x8) low-profile slot, from CPU_0

1 x OCP mezzanine slot with PCIe Gen3 x16 bandwidth, from CPU_0

Total:
Riser Card CRSH010 x 4:
- 4 x PCIe x16 (Gen3 x16) low-profile slots, from CPU_0

Riser Card CRSH011 x 4:
- 4 x PCIe x8 (Gen3 x8) low-profile slots, from CPU_0

4 x OCP mezzanine slots with PCIe Gen3 x16 bandwidth, from CPU_0
Internal I/O Per Node:
1 x COM header
2 x SATA 7-pin connectors
1 x TPM header
1 x BMC SGPIO header
1 x JTAG BMC header
1 x PLD header
1 x Clear CMOS jumper
1 x IPMB connector
1 x Buzzer
Front I/O Per Node:
1 x Power button with LED
1 x ID button with LED
1 x Status LED
1 x Reset button

Total:
4 x Power buttons with LED
4 x ID buttons with LED
4 x Status LEDs
4 x Reset buttons

*1 x CMC Status LED
*1 x CMC Reset button

*Only one CMC Status LED and Reset button per system
Rear I/O Per Node:
2 x USB 3.0
1 x VGA
1 x RJ45 MLAN
1 x ID LED

Total:
8 x USB 3.0
4 x VGA
4 x RJ45 MLAN
4 x ID LEDs
*1 x CMC port

*Only one CMC port per system
Backplane I/O Speed and bandwidth:
PCIe Gen3 x4
TPM 1 x TPM header with LPC interface
Optional TPM2.0 kit: CTM000
Power Supply 2 x 2200W 80 PLUS Platinum redundant power supplies

AC Input:
- 100-127V~/ 14A, 47-63Hz
- 200-240V~/ 12.6A, 47-63Hz

DC Input:
- 240Vdc/ 12.6A

DC Output:
- Max 1200W/ 100-127V~
+ 12.12V/ 95.6A
+ 12Vsb/ 3.5A
- Max 2200W/ 200-240V~
+ 12.12V/ 178.1A
+ 12Vsb/ 3.5A

Note: The system power supply requires C19 power cord
System Management Aspeed® AST2500 management controller
AMI MegaRAC SP-X Solution Web interface

Dashboard
JAVA Based Serial Over LAN
HTML5 KVM
Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
Sensor Reading History Data
FRU Information
SEL Log in Linear Storage / Circular Storage Policy
Hardware Inventory
Fan Profile
System Firewall
Power Consumption
Power Control
LDAP / AD / RADIUS Support
Backup & Restore Configuration
Remote BIOS/BMC/CPLD Update
Event Log Filter
User Management
Media Redirection Settings
PAM Order Settings
SSL Settings
SMTP Settings
OS Compatibility For Skylake processors:

Windows Server 2012 R2 Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 6.9 (x64) or later
Red Hat Enterprise Linux 7.3 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 11 SP4 (x64) or later
SUSE Linux Enterprise Server 12 SP2 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 16.04.1 LTS (x64) or later
Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 or later
VMware ESXi 6.7 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.4.0 or later
Citrix Hypervisor 8.0.0 or later

For Cascade Lake processors:

Windows Server 2012 R2 Update
Windows Server 2016
Windows Server 2019

Red Hat Enterprise Linux 7.6 (x64) or later
Red Hat Enterprise Linux 8.0 (x64) or later
Red Hat Enterprise Linux 9.0 (x64) or later

SUSE Linux Enterprise Server 12 SP3 (x64) or later
SUSE Linux Enterprise Server 15 (x64) or later

Ubuntu 18.04 LTS (x64) or later
Ubuntu 20.04 LTS (x64) or later
Ubuntu 22.04 LTS (x64) or later

VMware ESXi 6.0 Update3 or later
VMware ESXi 6.5 Update2 or later
VMware ESXi 6.7 Update1 or later
VMware ESXi 7.0 or later
VMware ESXi 8.0 or later

Citrix Xenserver 7.1.0 CU2 or later
Citrix Xenserver 7.5.0 or later
Citrix Hypervisor 8.0.0 or later
Weight Net Weight: 27.3 kg
Gross Weight: 45.92 kg
System Fans 8 x 80x80x38mm (16,300rpm)
Operating Properties Operating temperature: 10°C to 35°C
Operating humidity: 8-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Packaging Dimensions 1180 x 779 x 300 mm
Packaging Content 1 x H261-NO0
8 x CPU heatsinks
1 x Rail Kit
1 x VROC module
8 x Non-Fabric CPU carriers
Part Numbers - Barebone package: 6NH261NO0MR-00-1*
- Motherboard: 9MH61HD6NR-00
- VROC module: 25FD0-R181N0-10R
- Rail kit: 25HB2-AN6103-K0R
- CPU heatsink: 25ST1-253208-F2R/25ST1-253209-F2R
- M.2 extension card: 9CMTP01LNR-00 (optional)
- Backplane board - CBPH0O4: 9CBPH0O4NR-00
- Fan module: 25ST2-883828-D0R/25ST2-88382A-D0R
- Power Supply: 25EP0-222003-D0S
- C19 power cord 125V/15A (US): 25CP1-018000-Q0R (optional)
- C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R (optional)
- Ring topology kit: 6NH262Z65SR-00-100 (optional)
Order Information
Manufacturer SKU H261-NO0 (6NH261NO0MR-00)
System Building H261-NO0 (6NH261NO0MR-00) can be configured individually