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Dell R670 210-BNZH | Dual Xeon 6 1U PowerEdge Rackmount Server
long delivery time
Advantages:
- Virtualization
- Cloud-native applications
- All-flash SDS
- Hyperscale Workloads
- Scale out Databases
Price on request
- Manufacturer: Dell
-
Order number:
1254906
-
Manufacturer SKU:
210-BNZH
Configuration not found? Please use our server request form!
Dell PowerEdge R670 (210-BNZH): Optimized computing architecture for energy-efficient data... more
210-BNZH Product Information
Dell PowerEdge R670 (210-BNZH): Optimized computing architecture for energy-efficient data centers, equipped with dual Intel Xeon 6 CPUs
CPU:
Dual Intel Xeon 6 Series Processors
Up to 144 E-Cores / 86 P-Cores per Processor, supports up to 350W cTDP
GPU Accelerators:
Up to 3x 75W Single-Width
RAM:
32x DIMM slots, up to 8TB RAM DDR5-6400MT/s RDIMM ECC
LAN:
1x Dedicated Ethernet Port for iDRAC management
4x OCP NIC 3.0 cards (optional)
Expansion Slots:
Up to 2x PCIe Gen5 x16 slots (FH)
Up to 3x PCIe Gen5 x8 and x16 slot
M.2:
2x M.2 NVMe SSDs or M.2 Interposer board (DC-MHS): 2x M.2 NVMe SSDs or USB
Storage:
Up to 8 x EDSFF E3.S NVMe (SSD) max 122.88 TB also with FIO configuration
Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) max 245.76 TB
Up to 20 x EDSFF E3.S Gen5 NVMe (SSD) max 307.2 TB
Up to 8 x 2.5 inch SAS/SATA/NVMe Direct/NVMe Raid (SSD) max 122.88 TB
8 x 2.5-inch Universal 245.6 TB
Up to 10 x 2.5 inch SAS/SATA (SSD) max 38.4 TB
Up to 2 x EDSFF E3.S Gen5 NVMe (SSD) in the rear max 30.72 TB
| SKU Overview | ||
|---|---|---|
| R670 (210-BNZH) | Dual Intel Xeon 6 CPU, 20x E3.S NVMe Hot-Swap SSD drive bays, 5x PCIe Gen5 (4x FHHL, 1x LP), 2x 1800W redundant PSUs | |
Datasheet for Dell R670 (210-BNZH)
| Processor | |
|---|---|
| CPU | Two Intel Xeon 6 Processors with up to 144 E-cores or 86 P-cores per processor |
| Chipset | |
|---|---|
| - |
| GPU Accelerators | |
|---|---|
| Max GPU Count | Up to 3 x 75 W SW |
| System Memory | |
|---|---|
| Memory | 32 DDR5 DIMM slots, supports RDIMM 8 TB max, speeds up to 6400 MT/s Supports registered ECC DDR5 DIMMs only |
| Storage Controllers | |
|---|---|
| Internal Controllers | Front PERC H965i, Front PERC H975i*, Front PERC H365i |
| Internal Boot | Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS): HWRAID 1, 2 x M.2 NVMe SSDs or M.2 Interposer board (DC-MHS): 2 x M.2 NVMe SSDs or USB |
| Storage | |
|---|---|
| Front Bays | No Backplane configuration Up to 8 x EDSFF E3.S NVMe (SSD) max 122.88 TB also with FIO configuration Up to 16 x EDSFF E3.S Gen5 NVMe (SSD) max 245.76 TB* Up to 20 x EDSFF E3.S Gen5 NVMe (SSD) max 307.2 TB* Up to 8 x 2.5 inch SAS/SATA/NVMe Direct/NVMe Raid (SSD) max 122.88 TB 8 x 2.5-inch Universal 245.6 TB* Up to 10 x 2.5 inch SAS/SATA (SSD) max 38.4 TB* Up to 2 x EDSFF E3.S Gen5 NVMe (SSD) in the rear max 30.72 TB* |
| Power Supplies | |
|---|---|
| 1500 W Titanium 100—240 VAC or 240 VDC 1100 W Titanium 100—240 VAC or 240 VDC* 800 W Titanium 100—240 VAC or 240 VDC* 1800 W HLAC Titanium 200—240 VAC or 240 VDC* 1100 W Platinum 100—240 VAC or 240 VDC 800 W Platinum 100—240 VAC or 240 VDC 1500 W 277 VAC or 336 VDC* 1400 W LVDC -48 — -60 VDC* |
| Cooling Options | |
|---|---|
| Air cooling and Direct Liquid Cooling Note: DLC is a rack solution and requires rack manifolds and a cooling distribution unit (CDU) to operate. |
| Fans | |
|---|---|
| High performance Silver (HPR SLVR) or Standard (STD) fans Up to 4 sets (dual fan module) hot swappable fans |
| Dimensions | |
|---|---|
| Height – 42.8 mm (4.28 cm) Width – 482 mm (48.2 cm) Weight – 20.42 kg (45.02 pounds) Depth (for rear I/O configuration) 816.92 mm (81.69 cm) with bezel 815.14 mm (81.51 cm) without bezel Depth (for front I/O configuration) 829.44 mm (82.94 cm) without bezel Note: The front I/O configuration does not support the bezel. |
| Form Factor | |
|---|---|
| 1U rack server |
| Embedded Management | |
|---|---|
| iDRAC iDRAC Direct iDRAC RESTful API with Redfish RACADM CLI iDRAC Service Module (iSM) NativeEdge Endpoint NativeEdge Orchestrator |
| Bezel | |
|---|---|
| Optional security bezel |
| Security | |
|---|---|
| • Cryptographically signed firmware • Data at Rest Encryption (SEDs with local or external key mgmt) • Secure Boot • Secured Component Verification (Hardware integrity check) • Secure Erase • Silicon Root of Trust • System Lockdown • TPM 2.0 FIPS, CC-TCG certified • Chassis Intrusion Detection |
| Network options | |
|---|---|
| 4 x OCP NIC 3.0 cards (optional) and 1GbE*, 10GbE*, 25GbE, 100GbE and 400GbE* Slot 31 1 x 16 OCP 3.0 on front riser Slot 32 1 x 16 OCP 3.0 on front riser Slot 2 1 x 16 OCP 3.0 Slot 5 1 x 8 Gen5 OCP 3.0 or 1 x 16 Gen5 OCP 3.0 |
| BOSS | |
|---|---|
| Slot 34 1 x 4 BOSS Slot 3 1 x 4 BOSS |
| GPU options | |
|---|---|
| Up to 3 x 75 W SW |
| Ports | |
|---|---|
| Front Ports: 1 x USB 2.0 Type C port 1 x USB 2.0 Type A port (optional) 1 x Mini-DisplayPort (optional) 1 x DB9 Serial (with front I/O configuration) 1 x Dedicated ethernet port for iDRAC management Rear Ports: 1 x Dedicated ethernet port for iDRAC management 1 x VGA 2 x USB 3.1 Type A ports Internal Ports: 1 x USB 3.1 Type A port |
| PCIe | |
|---|---|
| Up to 2 x 16 Gen5 PCIe slots Slot 31 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser Slot 32 1 x 16 Full Height - Half Length or Full Height - Full Length or 1 x 16 OCP 3.0 on front riser Up to 3 x 16 or 2 x 8 Gen5 PCIe slots Slot 1 1 x 16 Full Height - Half Length or Full Height - Full Length or 3 x 16 or 1 x 8 Low Profile - Half Length Slot 2 1 x 16 or 1 x 8 Low Profile - Half Length or 1 x 16 OCP 3.0 Slot 4 1 x 16 Full Height - Half Length or 1 x 16 Low Profile - Half Length |
|
| Operating System and Hypervisors | |
|---|---|
| Canonical Ubuntu Server LTS Microsoft Windows Server with Hyper-V (P-Core only) Red Hat Enterprise Linux SUSE Linux Enterprise Server VMware ESXi |
|
| Order Information | ||
|---|---|---|
| Manufacturer SKU | R670 (210-BNZH) | |
| System Building | R670 (210-BNZH) can be configured individually | |